Contract Manufacturing

Our state-of-the-art surface mount process is designed for high volume runs with a high component mix. We are able to manufacture surface mount, through hole, as well as mixed assemblies.

• Double sided SMT and mixed technology
• Fine pitch placement to 12 mil
• 0201 passives
• Ball Grid array placement
• Through hole insertion
• ECO Rework Capabilities
• Mechanical assembly
• No clean flux
• Wave solder
• SMT stencil design and procurement
• Functional test capabilities
• Design for manufacturability services
• Device programming capabilities
• Environmental and ESD controls equipment
• Samsung CP20 pick and place
• Screen Printer
• Convection oven
• Contact Systems component locators (3)